AMD 3D V-Cache, which has been developed for many years, will be officially announced in 2021. Using chip stacking technology, it can increase the cache capacity of the CPU several times, and effectively improve the performance of the processor without changing the core area. After testing by foreign media Chips and Cheese, the new EPYC processor has lower latency and stronger performance.
From the specific data, the cache capacity of the new EPYC processor is larger, and the 3D V-Cache technology also increases the L3 cache delay to a certain extent, but the overall performance is still shrinking, and the performance is better. So, what are the highlights of AMD’s newly released 3D V-Cache technology?
In fact, it has already undergone a variety of tests when it was released in June 2021. From the results, even if the underlying architecture has not changed, but the L3 cache has been violently increased, the measured performance of the CPU has been greatly improved.
For the server GPU, only looking at the power consumption of a single package, the upper limit can reach 280W, but the actual running Compute Benchmark will be higher than the 3200 full plug-in situation. If you want to achieve multi-core performance, of course, the number of cores is inseparable. With enough memory channels, the number of cores can be significantly released, which also raises the expectations of many users.
There have been rumors on the Internet before that AMD will “magnify” to deal with Intel’s Alder Lake, and now it is mostly 3D V-Cache technology. Overall, this technology is based on the 3D Chiplets concept proposed by TSMC’s 3D-Fabric technology. It also adopts the idea of stacking, and the number of L3s is increased to 3 times, which can further release the processor performance and effectively improve the user experience.
But at the same time, some netizens pointed out many problems with AMD 3D V-Cache stacking technology: First, although the introduction of Cache can improve the sensitivity of the cache, it also greatly increases the cost. At the same time, similar to the Qualcomm Snapdragon, the performance improvement and the characteristics of 3D packaging have made the heat dissipation problem deeply criticized, and the corresponding link measures have not yet been proposed.
The real stacking material, the processor architecture of Zen 3, there is currently news that the price will exceed 10,000 US dollars, which is obviously expensive among the same type of processors, but how much more expensive it will be, there is no clear news yet, relatively At the 5000 price after Ryzen’s price increase, it is difficult to speculate on how AMD 3D V-Cache will control costs.