Intel announced to order ASML’s next-generation EUV exposure equipment, a move that raised questions from South Korea

According to a report by the “South Korea Economic Daily”, after the rare disclosure of the transaction between Intel, a major processor manufacturer, and the latest generation semiconductor exposure machine of ASML, a major manufacturer of lithography and exposure machine, it caused a stir in the market. question.

The report pointed out that this week Samsung Tel announced that it has ordered the industry’s first new generation of extreme ultraviolet exposure machine (EUV) TWINSCAN EXE: 5200 to ASML, indicating that the two companies will strengthen technical cooperation. In the announced statement, Intel’s purchase of this new generation of EUV exposure equipment will enable the wafer manufacturing rate to reach more than 200 wafers per hour, which is also an important part of Intel’s plan to develop advanced semiconductor processes.

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The report emphasized that the new generation of EUV exposure equipment ordered by Intel will be more advanced than the current wafer foundry leader TSMC, and the EUV exposure equipment for the latest 3nm process is more advanced. According to analysis by South Korean market watchers, Intel may use these new exposure equipment for the more advanced 2nm process chip manufacturing.

The report further emphasized that in March 2021, Intel announced its new IDM2.0 plan, planning to return to the global foundry market and further challenge the current industry leaders – TSMC and Samsung. In addition to Intel’s previous announcement that it will build two new fabs in Arizona, the latest news is that Intel also announced that it will spend $20 billion to build a new fab in Ohio, and the fastest is expected to be 2025. Operation put into production.

Intel to invest up to $100 billion in Ohio chip plants

In addition to announcing the construction of a fab with large sums of money, Intel also announced its semiconductor advanced process development plan, with the goal of entering the 1.8-nanometer advanced process production node by 2024. But in this regard, the report quoted South Korean market observers as saying that this plan seems a bit reluctant in terms of Intel’s current development pace in advanced manufacturing processes. Therefore, South Korean market participants believe that Intel’s unusual announcement of the latest deal with ASML is aimed at reducing the pressure on the market to question Intel’s technology. As for whether this is the case for the results, it remains to be observed.