New high! Affected by the lockdown in China and the earthquake in Japan, the chip delivery period in March was extended by another 2 days

Bloomberg reported that as China’s lockdown and the Fukushima earthquake in Japan further affected semiconductor supply, chip delivery in March rose slightly to 26.6 weeks, another record high.

According to research by Susquehanna Financial Group, wafer order-to-delivery time increased by 2 days from the previous month to 26.6 weeks. While users have had to face longer wait times, lead times have grown at a slower pace than last year, when many industries were forced to cut production due to a lack of critical components.

Susquehanna analyst Chris Rolland reports that lead times have increased for most chip types, including power management, microcontrollers, analogs, and memory; in addition, the Russian-Ukrainian war, the coronavirus lockdown in China, and the Fukushima earthquake in Japan have not only affected the first Seasons have short-term effects and may also have lingering effects on supply chains that are severely constrained throughout the year.

The world began to experience semiconductor shortages in the first half of 2020, and industries such as smartphones, home appliances, and automobiles stopped or reduced production. However, due to the continued shortage of chips, rising supply costs caused inflation.

Chip industry executives have warned that by 2023, it will be difficult for some customers to get enough supply, and even if companies such as Intel build large-scale new factories, they will not start production until next year at the earliest.

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